Steve Durrett / March 1, 2023
Plastronics is a leading global provider of technology and innovation for semiconductor reliability testing, meeting the industry’s burn-in socket needs for more than 40 years. It all started when our company invented the first open-top, application-specific socket for production burn-in of LCC packages. This innovation helped semiconductor manufacturers significantly increase their throughput and decrease costs.
Utilizing the H-pin technology, we provide Ball Grid Array Sockets (BGA) that are instrumental to your testing efforts.The H-pins ensure you receive a product that is both versatile and affordable. Over the last four decades, this has freed up our global client base to focus on creating amazing consumer, business, and military-grade electronics that push the boundaries of innovation.
We know you need BGA sockets that can handle high temperatures and currents. When they run fast and hot, you need confidence that they’ll hold up to the pressure. We design them to solve all your testing needs. In addition to a full line of BGA sockets, we offer reliable burn-in test socket solutions for all the latest devices. We have the most comprehensive QFN catalog in the world, as well as finished sockets to fulfill burn-in, humidity, failure analysis and test requirements for Leaded, LGA, and the other package types.
As companies are in the early stages of device development, they rely on Plastronics experts to collaborate with them through every stage so they can achieve the desired results. In this early stage, it is important to detail out a list of things you’ll need to know before making that next order or commitment:
Budget: Before placing an order, knowing what resources are available is essential. Rather than exact numbers, think in terms of allotments or ranges. Often this requires internal discussions. When done in advance of placing an order, it equips you with the answers you need to move forward confidently.
Timeline: Depending on the complexity of the requirement, there might be the need for discussions and engineering reviews prior to starting the manufacturing process. Additionally, complex designs with custom components take longer to manufacture. Therefore, it is critical to have a test completion date in mind. If all parties know this, then everyone can work to the desired schedules.
What Do You Need? Brainstorming and specific answers are two very different things. When you need a collaborative partner to identify the solution to your problem, it is an altogether different conversation than generating a quote for a predetermined scope of work. Thankfully, we specialize in both approaches and know the challenges and opportunities that can arise as a result.
Constraints: As with anything in our industry, it is essential to identify limitations early on. These are not deal-breakers, but an acknowledgment that achieving results sometimes requires innovation. We often see engineering teams come to the table with limits around workforce, timing, size, and a wide range of challenges with temperature, current, and frequency. Knowing those constraints upfront positions you to make an informed decision with your next order of BGA Sockets.
Big Picture: We thrive on matching your biggest goals and visions with our expertise. When we know desired outcomes from the beginning, it drives innovation and gets you the parts and results you need. Understanding this upfront before requesting your next order will go a long way to ensuring your success.
Our role in your next burn-in socket requirement is to help further your big objectives. No matter what your product, market, or end application, we have dedicated ourselves over the last four-plus decades to equipping you with sockets that mate perfect form, fit and function with your needs. We pride ourselves on offering interconnect solutions so your test applications are conducted on time and within budget.